UNIVAC 1830, CP-823/U

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90-PIN PC CARD DESIGNED AND MADE EXCLUSIVELY BY UNIVAC DEFENSE SYSTEMS FOR THE UNIVAC 1830, CP-823/U CENTRAL PROCESSOR AND AIR I/O, PROJECT A-NEW MOD 3, P-3 ORION, CIRCA 1965. CONTAINS THE FIRST MONOLITHIC SILICON INTEGRATED CIRCUITS IN FLATPACKS USED IN DIGITAL COMPUTERS. ALSO VERY EARLY RESISTOR/CAPACITOR FLATPACKS (BLACK), MADE BY SPRAGUE AND HALEX.

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ORIGINAL CP-667 (XN-1) / UYK, US NAVY NAVSHIPS 94109, CIRCA 1963, 30-BIT TROUBLESHOOTING NOTEBOOK WITH TROUBLESHOOTING CODES, INSTRUCTION SEQUENCES AND SCHEMATICS OF THE 27-PIN CARDS USED IN THE ONLY CP-667 30-BIT COMPUTER AND THE GROUND I/O OF THE UNIVAC 1830 CP-823/U, P-3 ORION PROJECT A-NEW MOD 3. SEEMS TO BE 98%  COMPLETE. MOST LIKELY THE ONLY COPY THAT WAS EVER MADE.

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COLLECTION OF SIX (6) 27-PIN PC CARDS DESIGNED AND MADE EXCLUSIVELY FOR THE 30-BIT CP-667 COMPUTER.  3 CARDS CONTAIN THE FIRST HYBRID 10-LEAD INTEGRATED CIRCUITS IN T-O5 CANS, DEVELOPED BY UNIVAC AND MADE BY MOTOROLA  FOR UNIVAC FOR THE US NAVY. ONE CARD CONTAINS TWO EARLY EXPERIMENTAL MONOLITHIC SILICON CHIPS CONTAINED IN 14-LEAD FLATPACKS. SINCE ONLY ONE CP-667 WAS MADE, THE CARDS WERE USED IN THE GROUND I/O AND CONTROL PANEL OF THE UNIVAC 1830, CP-823/U IN THE P-3 ORION PROJECT A-NEW MOD 3 DIGITAL AIRBORNE PROTOTYPE COMPUTER. CIRCA 1964. 

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90-PIN PC CARD DESIGNED AND MADE EXCLUSIVELY BY UNIVAC DEFENSE SYSTEMS FOR THE UNIVAC 1830, CP-823/U CENTRAL PROCESSOR AND AIR I/O, PROJECT A-NEW MOD 3, P-3 ORION, CIRCA 1965. ONLY 1 OF 2 CARDS IN THE AIRBORNE I/O TO CONTAIN DISCRETE ELECTRONICS. THE FEW THAT WERE MADE WERE REMOVED FROM SERVICE IN 1965 (I HAVE THEM ALL) AND REPLACED WITH EXPERIMENTAL 14-LEAD SILICON CHIPS.

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90-PIN INPUT AMPLIFIER PC CARD DESIGNED AND MADE EXCLUSIVELY BY UNIVAC DEFENSE
SYSTEMS FOR THE UNIVAC 1830, CP-823/U CENTRAL PROCESSOR AND AIR I/O, PROJECT
A-NEW MOD 3, P-3 ORION, CIRCA 1965. CONTAINS THE FIRST MONOLITHIC SILICON
INTEGRATED CIRCUITS IN FLATPACKS USED IN DIGITAL COMPUTERS, MADE BY WESTINGHOUSE FOR UNIVAC. ONLY 1 OF 2 CARDS IN THE AIRBORNE I/O TO CONTAIN DISCRETE ELECTRONICS. THE FEW THAT WERE
MADE WERE REMOVED FROM SERVICE IN 1965 (I HAVE THEM ALL) AND REPLACED WITH EXPERIMENTAL 14-LEAD
SILICON CHIPS. 

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CORDWOOD BLOCK ELECTRONICS BURNDY PACK. DESIGNED, BUILT AND USED EXCLUSIVELY IN
THE UNIVAC 1830, CP-823/U 32,000 WORD MEMORY UNIT. CONTAINS ONE MONOLITHIC
SILICON FLATPACK MADE BY RATHEON, RESISTORS AND TRANSISTORS.

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CORDWOOD BLOCK ELECTRONICS BURNDY PACK. DESIGNED, BUILT AND USED
EXCLUSIVELY IN THE UNIVAC 1830, CP-823/U 32,000 WORD MEMORY UNIT. CONTAINS ONE
MONOLITHIC SILICON FLATPACK MADE BY RATHEON. THIS STYLE IS ENCLOSED IN AN ALUMINUM CASE AND THE ELECTRONICS ARE COMPLETELY SEALED IN RESIN.